Shin-Etsu T.I.M. material series of soft and ultra soft pads for semiconductors, semiconductor substrates and modules.
Features:
- Excellent performance due to low to ultra low hardness
- Sheet thickness 0.5 ~ 10 mm
- Reducing contact thermal resistance by filling surface unevenness of modules
- Reducing mechanical stress on components
- High electric insulation and flame resistance
Applications:
- Semiconductors with mounted heatsinks, LED modules and Automotive modules
- EV batteries
- PCB to die-cast heatsinks
