T.I.M. soft pads

Shin-Etsu T.I.M. material series of soft and ultra soft pads for semiconductiors, semiconductor substrates and modules.

Shin-Etsu T.I.M. material series of soft and ultra soft pads for semiconductors, semiconductor substrates and modules.

Features:

  • Excellent performance due to low to ultra low hardness
  • Sheet thickness 0.5 ~ 10 mm
  • Reducing contact thermal resistance by filling surface unevenness of modules
  • Reducing mechanical stress on components
  • High electric insulation and flame resistance

Applications:

  • Semiconductors with mounted heatsinks, LED modules and Automotive modules
  • EV batteries
  • PCB to die-cast heatsinks

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Thermal Interface materials - soft pads

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Thermal Interface materials

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