T.I.M. hard pads

Shin-Etsu T.I.M. material series of hard pads for power transistors.

Features:

Excellent performance due to high hardness
Sheet thickness 0.11 mm or more
Glass fiber or polyimide film reinforcement layer to obtain high physical strength
High electric insulation and flame resistance
One side adhesive optional
Moulded shapes like caps, tubes and custom designs available

Applications:

Power transistors for power supplies, power modules, energy convertors and automotive electronics
Thermal clad interposer for heatbonding anisotropic adhesive tape

For inquiries, further product information or local contact information, you can use this inquiry form.

All fields marked with an * are required

"*" indicates required fields

Company/Organisation

Name*

First Last

From*

City Country

Email*

Message*

Comments

This field is for validation purposes and should be left unchanged.

Related products