Shin-Etsu Sepla Film® is a Super Engineering Plastic Films; ultra thin and non-stretched.
- non-stretched film of non-crystallized plastics
- non-stretched and low crystallized film of crystallized plastics
- several surface patterns
PEEK (Polyether Ether Ketone) offers outstanding physical, thermal and chemical properties resulting in excellent resistance against thermal, chemical and mechanical stress and wear.
Shin-Etsu Polymer’s knowledge in micromoulding is used to create low internal tension ultrathin films starting from 3 μm of thickness.
Features:
- Ultra thin film created by non-stretching micro moulding in low crystallizing state
- High tensile strength and rigidity
- Superior heat tolerance
- Superior friction resistance
- Superior chemical resistance
- Roughening of film surface optional
- Sliding and conductivity characteristics optional (composite blending)
Applications for Sepla Film®:
- Acoustic membrane for speakers for small handheld devices
- Isolation layers in multilayer PCB or antenna for high frequency devices like 5G network terminals or network devices
- Isolation of wires for EV motors or wires in harsh environment applications
- Interior panels for airplanes
Shin-Etsu Sepla Film® - extended material property comparison
Unit | PA9T | PEEK | Test method | ||
---|---|---|---|---|---|
Crystalline/Amorphous | - | Crystalline | Crystalline | ||
Specific gravity | - | 1.14 | 1.31 | ||
Glass transition point Melting point | °C | 125 300 | 146 339 | DSC ΔT: 10°C/min. |
|
Linear expansion coefficient | MD* TD* | °C-1 | 31 • 10^-6 101 • 10^-6 | JIS K7197 ΔT: 5°C/min. |
|
Elasticity or Tensile Modulus | MD* TD* | N/mm2 | 2168 2183 | 3720 2940 | JIS K6781 (23°C/50%RH) test speed: 50 mm/min. |
Yield strength | MD* TD* | N/mm2 | - | 80 75 |
|
Tensile strength | MD* TD* | N/mm2 | 81 84 | 135 83 |
|
Elongation | MD* TD* | % | 223 235 | 72 239 |
|
Breakdown voltage | kV/mm | 22.6 | JIS C2110 Elec cylinder: (23°C/50%RH) |
||
Dielectric strength | kV/mm | - | 16 | ||
Dielectric constant | - | - | 3.30 | ||
Dielectric tangential loss | - | - | 0.003 (1 GHz) | ||
Thermal conductivity | W/m•K | 0.25 | |||
Flame retardance (UL94) | - | - | V-0 (1.5 mm) | ||
Water absorbing property (23°C / 24 hrs) | - | - | 0.1 | ||
Density | kg/dm3 | 1.32 | |||
Gas permeability | O2 N2 CO2 | cc(stp)/m2 | 3.0 • 10^3 7.5 • 10^1 5.9 • 10^3 | JIS K7126-1 (Diff pressure method) (24 hrs @ atm) |
|
* MD is machining direction / TD is transverse direction. |
PEEK - extended material property at 120 ºC
Unit | T = 3 µm | T = 7 µm | ||
---|---|---|---|---|
Tensile strength | MD* TD* | N/mm2 | 69 59 | 67 45 |
Tensile strain at break | MD* TD* | % | 107 243 | 94 192 |
Modulus of elasticity in tension (Young) | MD* TD* | N/mm2 | 1980 1380 | 1970 1550 |
Degree of crystallization | % | < 10 | 20 ~ 30 | |
* MD is machining direction / TD is transverse direction Test method: JIS K7160-3 (120°C), tensile speed: 50 mm/min. |
PEEK film dimensions and tolerances
Unit | Value | ||
---|---|---|---|
Thickness of film | T | µm | 3 ~ 50 ± 5% * 6 ~ 250 ± 5% ** |
Width of film (on roll) | W | mm | 650 or 1310 |
Length of film on roll (max) | L | m | 2000 (3~6 µm T) 1000 (7~20 µm T) 750 (21~25 µm T) 300 (26~50 µm T) |
Core of roll | ∅ | inch | 3 or 6 |
* Non-stretched film of amorphous plastics ** Non-stretched and high crystallized film of crystallized plastics The average value complaint with JIS C2330:2010 and IEC60674-3-1:1998 (n5*20) |