The MT-type of Inter-Connector, used for testing IC-devices in packages like BGA, QFP, SOP, Flip-Chip or Bumped Wafers, consists of parallel rows of gold-plated brass wires in a silicone rubber sheet.
Wires are positioned under an angle of 60° to ease compression and improve durability. The wire angle of 60° requires contacts to use an offset of half the thickness of the silicone rubber sheet. Randomly positioning the Inter-Connector between contact pads and providing compresssion wil realize a stable, low resistance connection.
Proper connection is provided by compression forces of 0.2 ~ 0.5 N per contact ball or land on the IC device, depending on the contact size and shape.
The MT-type is one of the derivatives of the GB-type and the base of several versions of MT-types dedicated to specialized fields of device testing. The MT-4X is having a 4 times higher wire density for fine pitch IC devices. The MT-T is providing ultra high signal transmission up to 13 Ghz due to its small sheet thickness.
The MT-P is having wires protruding the sheet surface by 20 µm to ease contacting ultra fine and mechanically sensitive devices with flat contacts like LGA packages. The protruded wires of the MT-P-type are Ni/Au-plated.
MT Type Dimensions
Full data in download| Parameter | Unit | Value |
|---|---|---|
| Pitch P, Ps | mm | 0.05/ 0.1 |
| Sheet thickness | mm | 0.1 ~ 2 |
| Length | mm | 5 ~ 50 |
| Width | mm | 5 ~ 50 |
| Conductive fiber diameter | µm | 23/ 40 |
MT Type Properties
Full data in download| Parameter | Unit | Value |
|---|---|---|
| Contact resistance | Ω | < 0.1 |
| Current carrying capacity | mA/wire | 50 |
| Dielectric breakdown voltage | kV/mm | 23 ~ 27 |
| Isolation resistance (500V DC) *** | MΩ | > 10^3 |
| Operating temperature range | °C | -35 ~ 100 |
